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TS3DDR4000 Texas instruments

TS3DDR4000
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TS3DDR4000
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The TS3DDR4000 is 1:2 or 2:1 high speed DDR2/DDR3/DDR4 switch that offers 12-bit wide bus switching. The A port can be switched to the B or C port for all bits simultaneously. Designed for operation in DDR2, DDR3 and DDR4 memory bus systems, the TS3DDR4000 uses a proprietary architecture that delivers high bandwidth (single-ended –3dB bandwidth at 5.6 GHz), low insertion loss at low frequency, and very low propagation delay. The TS3DDR4000 is 1.8 V logic compatible, and all switches are bi-directional for added design flexibility. The TS3DDR4000 also offers a low-power mode, in which all channels become high-Z and the device consumes minimal power.
  • Wide VDD Range: 2.375 V – 3.6 V
  • High Bandwidth: 5.6 GHz Typical (single-ended); 6.0 GHz Typical (differential)
  • Low Switch On-Resistance (RON): 8 Ω Typical
  • Low Bit-to-Bit Skew: 3ps Typical; 6ps Max across All Channels
  • Low Crosstalk: –34 dB Typical at 1067 MHz
  • Low Operating Current: 40 µA Typical
  • Low-Power Mode with Low Current Consumption: 2 µA Typical
  • IOFF Protection Prevents Current Leakage in Powered Down State (VDD = 0 V)
  • Supports POD_12, SSTL_12, SSTL_15 and SSTL_18 Signaling
  • ESD Performance:
    • 3-kV Human Body Model (A114B, Class II)
    • 1-kV Charged Device Model (C101)
  • 8 mm x 3 mm 48-balls 0.65-mm Pitch ZBA Package
Protocols DDR2, DDR3, DDR4, MIPI
Configuration 2:1 SPDT
Number of channels 12
Supply voltage (max) (V) 3.6
Supply voltage (min) (V) 2.375
Ron (typ) (mΩ) 8300
Input/ouput voltage (min) (V) 0
Input/ouput voltage (max) (V) 3.3
Supply current (typ) (µA) 40
ESD HBM (typ) (kV) 3
Operating temperature range (°C) -40 to 85
Crosstalk (dB) -68
COFF (typ) (pF) 1
CON (typ) (pF) 0.5
Off isolation (typ) (dB) -34
OFF-state leakage current (max) (µA) 5
Ron (max) (mΩ) 11200
Ron channel match (max) (Ω) 1
RON flatness (typ) (Ω) 0.6
Turnoff time (disable) (max) (ns) 65
Turnon time (enable) (max) (ns) 65
VIH (min) (V) 1.4
VIL (max) (V) 0.5
TS3DDR4000