The AFE1256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of
flat-panel detectors (FPDs) based on digital X-ray systems. The device includes 256 integrators, a
programmable gain amplifier (PGA) for full-scale, charge-level selection, a correlated double
sampler (CDS) with dual banking, 256:4 analog multiplexers, and four 16-bit,
successive-approximation register (SAR) analog-to-digital converters (ADCs) onboard. Serial data
from the ADCs are available in SPI™ format.
Hardware-selectable integration polarity allows for the integration of positive or
negative charge and provides more flexibility in system design. The Nap feature enables substantial
power saving. This power savings is especially useful in battery-powered systems.
The device is available as a 22-mm × 5-mm gold-bumped
die and a 38-mm × 28-mm, COF-314 TDS package in
singulated forms.
To request a full data sheet or other design resources:
request AFE1256
- 256 Channels
- On-Chip, 16-Bit ADC
- Photodiode Short Immunity
- Column Short Immunity
- High Performance:
- Noise: 758 e-RMS with 28-pF Sensor
Capacitor in 1.2-pC Range - Integral Nonlinearity:
±2 LSB with Internal 16-Bit ADC - Minimum Scan Time:
- 37.9 µs in Normal Mode
- 20 µs in 2x Binning Mode
- Integration:
- Eight Selectable Full-Scale Ranges:
0.15 pC (Min) to 9.6 pC (Max) - Built-In Correlated Double Sampler
- 2x Binning (Averages Charge of Two Adjacent
Channels) for Faster Throughput - Pipelined Integrate and Read: Allows Data
Read During Integration
- Flexibility:
- Electron and Hole Integration
- Low Power:
- 2.9 mW/Ch with ADC
- 2.3 mW/Ch without ADC
- 0.1 mW/Ch in Nap Mode
- Total Power-Down Feature
- 22-mm × 5-mm Gold-Bump Die,
Suitable for TCP and COF
Application
- Flat-Panel, X-Ray Detector
All trademarks are the property of their respective owners.
| Product type | Sensors |
| Die or wafer type | Tested Die |
| Rating | Catalog |
| Operating temperature range (°C) | 0 to 70 |